Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al. J Electron Mater. 2012;41:1868-81. Abstract
Analysis of Ce- and Yb-Doped TAGS-85 Materials with Enhanced Thermoelectric Figure of Merit. Adv Funct Mater. 2011;21:441-7. Abstract
Enhanced wear resistance in AlMgB(14)-TiB(2) composites. Wear. 2011;271:640-6. Abstract
Analysis of wear mechanisms in low-friction AlMgB14-TiB2 coatings. Surf Coat Tech. 2010;205:2296-301. Abstract
Estimation of surface energy and bonding between AlMgB14 and TiB2. Journal of Physics and Chemistry of Solids. 2010;71:824-6. Abstract
Analysis of Nanostructuring in High Figure-of-Merit Ag1-xPbmSbTe2+m Thermoelectric Materials. Advanced Functional Materials. 2009;19:1254-9. Abstract
Erosion resistance of TiB2-ZrB2 composites. Wear. 2009;267:136-43. Abstract
Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design. Journal of Electronic Materials. 2009;38:2770-9. Abstract
Microstructure and wear resistance of low temperature hot pressed TiB2. Wear. 2009;266:1171-7. Abstract
















