Thermal stability and strength of deformation microstructures in pure copper. Acta Mater. 2012;60:4107-16. Abstract
Vacancies, twins, and the thermal stability of ultrafine-grained copper. Appl Phys Lett. 2011;99:231911. Abstract
Deformation of hierarchically twinned martensite. Acta Materialia. 2010;58:5242-61. Abstract
Triple lines in materials science and engineering. Scripta Materialia. 2010;62:889-93. Abstract
Anomalous triple junction surface pits in nanocrystalline zirconia thin films and their relationship to triple junction energy. Acta Materialia. 2009;57:3662-70. Abstract
A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper. Acta Materialia. 2009;57:5491-500. Abstract
Effects of residual (or internal) stress on ferroelectric domain wall motion in tetragonal lead titanate. Journal of Materials Research. 2009;24:1803-9. Abstract
Strain fields and energies of grain boundary triple junctions. Acta Mater. 2008;56:5728-36. Abstract
