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Contains the keyword microstructure

Zhou SH, Napolitano RE. Identification of the B33 martensite phase in Cu-Zr using first-principles and X-ray diffraction. Scr Mater. 2008;59:1143-6. Abstract
Stumphy B, Mudryk Y, Russell A, Herman D, Gschneidner K. Oxidation resistance of B2 rare earth-magnesium intermetallic compounds. J Alloy Compd. 2008;460:363-7. Abstract
Herman DM, Cao GH, Becker AT, Russell AM, Constant AP. Microstructure and properties of a silver-erbium oxide alloy. J Alloy Compd. 2008;454:292-6. Abstract
Tang ZH, Kramer MJ, Akinc M. Evaluation of phase equilibria in the Nb-rich portion of Nb-B system. Intermetallics. 2008;16:255-61. Abstract
Kalay YE, Chumbley LS, Anderson IE. Characterization of a marginal glass former alloy solidified in gas atomized powders. Mater Sci Eng A-Struct Mater Prop Microstruct Process. 2008;490:72-80. Abstract
Tang ZH, Williams JJ, Thom AJ, Akinc M. High temperature oxidation behavior of Ti5Si3-based intermetallics. Intermetallics. 2008;16:1118-24. Abstract
Venkataraman S, Eckert J, Schultz L, Sordelet DJ. Studies on the crystallization kinetics of Cu-reinforced partially crystalline Cu47Ti33Zr11Ni8Si1 metallic glass composite. J Alloy Compd. 2007;434:203-6. Abstract
Anderson IE. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications. J Mater Sci-Mater Electron. 2007;18:55-76. Abstract
Venkataraman S, Hermann H, Mickel C, Schultz L, Sordelet DJ, Eckert J. Calorimetric study of the crystallization kinetics of Cu47Ti33Zr11Ni8Si1 metallic glass. Phys Rev B. 2007;75:104206. Abstract
Anderson IE, Walleser J, Harringa JL. Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints. Jom. 2007;59:38-43. Abstract